Patent Assignment
Reel/Frame 049916/0995
Assignment of Assignor's Interest
Recorded: 2019-07-31
Pages: 5
Assignors
TUNG, HUAI-JEN
Executed: 2019-05-28
SU, CHING-CHUNG
Executed: 2019-06-12
LIAO, KENG-YING
Executed: 2019-05-28
CHEN, PO-ZEN
Executed: 2019-05-28
YEH, SU-YU
Executed: 2019-05-28
CHEN, S.Y.
Executed: 2019-05-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Image Sensor with Pad Structure