Patent Assignment
Reel/Frame 049923/0287
Assignment of Assignor's Interest
Recorded: 2019-07-31
Pages: 3
Assignor
HUANG, MING-TAU
Executed: 2019-07-29
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Acoustic Device Including the Same