Patent Assignment
Reel/Frame 049930/0620
Assignment of Assignor's Interest
Recorded: 2019-08-01
Pages: 3
Assignors
LEE, SANG-EUN
Executed: 2019-07-19
LEE, HYUNG-DONG
Executed: 2019-07-19
KO, EUN
Executed: 2019-07-29
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Having Mold Vias and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.