Stacked semiconductor package having mold vias and method for manufacturing the same

1. A method for manufacturing a stacked semiconductor package, comprising:

disposing first semiconductor chips having first active surfaces over which first bonding pads including peripheral bonding pads and a central bonding pad are arranged, over a carrier wafer such that the carrier wafer and the first active surfaces face each other;

forming a first encapsulation member which covers the first semiconductor chips, over the carrier wafer such that a reconfigured wafer in which the first semiconductor chips are redisposed is constructed;

removing the carrier wafer from the reconfigured wafer;

bonding two second semiconductor chips to one first semiconductor chip on the reconfigured wafer at a distance from each other, wherein the second semiconductor chips have second active surfaces over which second bonding pads are arranged at side peripheries adjacent to the first semiconductor chip, wherein the second semiconductor chips have first coupling members formed on the second bonding pads, wherein the second semiconductor chips possess a thickness greater than a target thickness, and wherein the second semiconductor chips are disposed on the reconfigured wafer, such that the second active surfaces face the first active surface, the second bonding pads are coupled with the peripheral bonding pads by the first coupling members and the central bonding pad is exposed;

forming a second encapsulation member over the reconfigured wafer in such a way as to cover the second semiconductor chips;

removing a partial thickness of the second encapsulation member and the second semiconductor chips such that the target thickness of the second semiconductor chips remains; and

forming a mold via which is coupled with the central bonding pad of the first semiconductor chip, and which pass through a portion of the second encapsulation member in a region between the second semiconductor chips,

after the forming of the mold via:

forming a bump pad which is disposed over the mold via and dummy pads which are disposed over second surfaces of the second semiconductor chips; and

forming a second coupling member over the bump pad, and forming support members over the dummy pads;

wherein the first semiconductor chip and the mold via do not include any through via for connecting between the peripheral bonding pads and the second bonding pads.

2. The method according to claim 1 further comprising, after the forming of the second coupling member and the support members:

sawing a resultant product with the second coupling member and the support members such that the resultant product is separated into a plurality of chip stacks including the first and second semiconductor chips, the first and second encapsulation members and the mold via.

3. The method according to claim 2 , further comprising, after the sawing of the resultant product:

bonding the chip stacks to a top surface of a substrate having the top surface over which a bond finger is arranged and a bottom surface under which an electrode terminal is arranged, such that the second coupling member and the bond finger are coupled with each other;

forming a third encapsulation member over the substrate in such a way as to cover side surfaces of the first and second encapsulation members;

partially removing the third encapsulation member and the first back surface of the first encapsulation member such that the first surfaces of the first semiconductor chips are exposed; and

forming an external coupling member over the electrode terminal.

4. The method according to claim 3 , further comprising, after the forming of the external coupling members:

singulating a resultant product such that the resultant product is separated into individual packages.

5. The method according to claim 2 , further comprising, after the sawing of the resultant product:

bonding a chip stack to a top surface of a substrate having the top surface over which a bond finger is arranged and a bottom surface under which an electrode terminal is arranged, such that the second coupling member and the bond finger are coupled with each other;

forming an underfill to fill spaces between the second semiconductor chips and the second encapsulation member and the top surface of the substrate; and

forming an external coupling member over the electrode terminal.

6. The method according to claim 5 , further comprising, after the forming of the external coupling members:

singulating a resultant product such that the resultant product is separated into individual packages.

7. The method according to claim 2 , further comprising, after the forming of the mold vias:

forming a first dielectric layer under second surfaces of the second semiconductor chips facing away from the second active surfaces, and the second encapsulation member in such a way as to leave exposed the mold via;

forming, under the first dielectric layer, a redistribution line having one end which is coupled with the exposed mold via;

forming a second dielectric layer under the redistribution line and the first dielectric layer in such a way as to expose the other end of the redistribution line facing away from the one end; and

forming, under the second dielectric layer, a redistribution pad which is coupled with the exposed other end of the redistribution line.

8. The method according to claim 7 , further comprising, after the forming of the redistribution pad:

forming an external coupling member under the redistribution pad; and

singulating a resultant product such that the resultant product is separated into individual packages.