Patent Assignment
Reel/Frame 049934/0346
Assignment of Assignor's Interest
Recorded: 2019-08-01
Pages: 7
Assignors
BRIGGS, BASOENE
Executed: 2019-07-31
WILSON, CHRISTOPHER
Executed: 2019-08-01
BOEMMELS, JUERGEN
Executed: 2019-07-31
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Forming a Multi-Level Interconnect Structure