Patent Assignment
Reel/Frame 049934/0629
Assignment of Assignor's Interest
Recorded: 2019-08-01
Pages: 4
Assignors
LAI, CHI-HUI
Executed: 2019-06-28
CHUN, SHU-RONG
Executed: 2019-06-28
PAN, KUO LUNG
Executed: 2019-07-04
KUO, TIN-HAO
Executed: 2019-07-03
TSAI, HAO-YI
Executed: 2019-07-04
LIU, CHUNG-SHI
Executed: 2019-07-08
YU, CHEN-HUA
Executed: 2019-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method