Patent Assignment
Reel/Frame 049937/0506
Assignment of Assignor's Interest
Recorded: 2019-08-01
Pages: 5
Assignors
QIN, FEI
Executed: 2019-05-10
ZHANG, LIXIANG
Executed: 2019-05-10
ZHAO, SHUAI
Executed: 2019-05-10
CHEN, PEI
Executed: 2019-05-10
AN, TONG
Executed: 2019-05-10
DAI, YANWEI
Executed: 2019-05-10
Assignee
BEIJING UNIVERSITY OF TECHNOLOGY
NO. 100 PINGLEYUAN, CHAOYANG DISTRICT, BEIJING, CHINA
Covered Property
(1)
Device And Method For On-line Measurement Of Wafer Grinding Force