Patent Assignment
Reel/Frame 049939/0226
Assignment of Assignor's Interest
Recorded: 2019-08-02
Pages: 3
Assignor
WIMPLINGER, MARKUS
Executed: 2017-07-25
Assignee
EV GROUP E. THALLNER GMBH
DI ERICH THALLNER STRASSE 1, ST. FLORIAN AM INN, A-4782, AUSTRIA
Covered Property
(1)
Method and Device for Bonding of Chips