Patent Assignment
Reel/Frame 049944/0661
Assignment of Assignor's Interest
Recorded: 2019-08-02
Pages: 4
Assignor
CHOI, YUN-SEOK
Executed: 2019-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same