Patent Assignment
Reel/Frame 049969/0669
Assignment of Assignor's Interest
Recorded: 2019-08-06
Pages: 6
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTR. 4, REGENSBURG, 93055, GERMANY
Covered Property
(1)
Solder Pads of Variable Thickness in an Optoelectronic Semiconductor Chip, on a Connection Substrate for Mounting a Semiconductor Chip, Method of Producing an Optoelectronic Component, and Optoelectronic Component Having the Solder Pads
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.