Patent Assignment
Reel/Frame 049972/0128
Assignment of Assignor's Interest
Recorded: 2019-08-06
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO 107-6325, JAPAN
Covered Property
(1)
Method of Removing Particles of Substrate Processing Apparatus, and Substrate Processing Apparatus