Patent Assignment
Reel/Frame 049977/0863
Assignment of Assignor's Interest
Recorded: 2019-08-06
Pages: 5
Assignors
PIAO, MEIYU
Executed: 2019-07-11
ODANAKA, KENTARO
Executed: 2019-07-19
WAKAHARA, MASATOSHI
Executed: 2019-07-11
ONOE, WAKANA
Executed: 2019-07-11
LAN, HEIDI
Executed: 2019-07-11
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method