Patent Assignment
Reel/Frame 049997/0784
Assignment of Assignor's Interest
Recorded: 2019-08-08
Pages: 8
Assignors
YANG, TAI-I
Executed: 2019-05-23
SU, LI-LIN
Executed: 2019-04-12
WU, YUNG-HSU
Executed: 2019-04-12
CHEN, HSIN-PING
Executed: 2019-04-12
CHUANG, CHENG-CHI
Executed: 2019-04-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Interconnect Structures with Air Gaps