Patent Assignment
Reel/Frame 050002/0162
Assignment of Assignor's Interest
Recorded: 2019-08-08
Pages: 3
Assignors
CHO, JUNG HYUN
Executed: 2019-07-24
LEE, YOUNG KWAN
Executed: 2019-07-24
HUR, YOUNG SIK
Executed: 2019-07-24
LEE, YUN TAE
Executed: 2019-07-24
YOON, HO KWON
Executed: 2019-07-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Bridge Embedded Interposer, and Package Substrate and Semicondcutor Package Comprising the Same