Patent Assignment
Reel/Frame 050006/0464
Assignment of Assignor's Interest
Recorded: 2019-08-08
Pages: 3
Assignors
MALLIK, DEBENDRA
Executed: 2019-08-02
MAHAJAN, RAVINDRANATH
Executed: 2019-08-02
RAORANE, DIGVIJAY
Executed: 2019-08-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Ic Package Including Multi-Chip Unit with Bonded Integrated Heat Spreader