Patent Assignment
Reel/Frame 050018/0398
Assignment of Assignor's Interest
Recorded: 2019-08-09
Pages: 4
Assignors
TSAI, CHI-MING
Executed: 2019-05-24
LIU, CHUNG-SHI
Executed: 2019-07-19
LIN, CHIH-WEI
Executed: 2019-05-31
HO, MING-CHE
Executed: 2019-05-24
HUANG, TZU-SUNG
Executed: 2019-05-24
TSENG, MING HUNG
Executed: 2019-05-24
LIN, YEN-LIANG
Executed: 2019-05-24
TSAI, HAO-YI
Executed: 2019-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method