Patent Assignment
Reel/Frame 050020/0200
Assignment of Assignor's Interest
Recorded: 2019-08-11
Pages: 6
Assignors
TENG, PO-YUAN
Executed: 2019-06-18
SU, BOR-RUNG
Executed: 2019-06-19
LU, DE-YUAN
Executed: 2019-06-18
TSAI, HAO-YI
Executed: 2019-06-25
KUO, TIN-HAO
Executed: 2019-06-19
LEE, TZUNG-HUI
Executed: 2019-06-19
CHANG, TAI-MIN
Executed: 2019-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semicondcutor Package and Manufacturing Method Thereof