Patent Assignment
Reel/Frame 050024/0793
Assignment of Assignor's Interest
Recorded: 2019-08-12
Pages: 6
Assignors
KIM, SUIN
Executed: 2019-01-31
KIM, JIYONG
Executed: 2019-02-01
LEE, SUNG-KI
Executed: 2019-02-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same