Patent Assignment
Reel/Frame 050027/0805
Assignment of Assignor's Interest
Recorded: 2019-08-12
Pages: 3
Assignors
ZHUANG, HUI-ZHONG
Executed: 2018-02-08
CHIANG, TING-WEI
Executed: 2018-02-09
LU, LEE-CHUNG
Executed: 2018-02-27
TIEN, LI-CHUN
Executed: 2018-02-24
CHEN, SHUN LI
Executed: 2018-02-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming an Integrated Circuit