Patent Assignment
Reel/Frame 050036/0492
Assignment of Assignor's Interest
Recorded: 2019-08-13
Pages: 7
Assignors
CHOI, SEUNG HOON
Executed: 2019-07-10
KOO, JAEUNG
Executed: 2019-07-11
KIM, KWANSUNG
Executed: 2019-07-15
KIM, BO YUN
Executed: 2019-07-15
KIM, WANDON
Executed: 2019-07-15
YOON, BOUN
Executed: 2019-07-15
YIM, JEONGHYUK
Executed: 2019-07-10
JEON, YERYUNG
Executed: 2019-07-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Interconnections Having Different Structures and Method of Fabricating the Same