Patent Assignment
Reel/Frame 050051/0461
Assignment of Assignor's Interest
Recorded: 2019-08-14
Pages: 7
Assignors
LEE, JOUNGPHIL
Executed: 2019-06-12
KANG, MYUNG-SUNG
Executed: 2019-06-12
KIM, YOUNGSEOK
Executed: 2019-06-13
SEO, GWANGSUN
Executed: 2019-06-13
YOO, HYEIN
Executed: 2019-06-12
CHOI, YOUNGWON
Executed: 2019-06-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Adhesive Film, Semiconductor Apparatus Using the Same, and Semiconductor Package Including the Same