Patent Assignment
Reel/Frame 050051/0630
Assignment of Assignor's Interest
Recorded: 2019-08-14
Pages: 3
Assignors
HA, JOB
Executed: 2019-06-12
KIM, SUNG HYUN
Executed: 2019-06-12
JEUNG, JI NA
Executed: 2019-06-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Hybrid Interposer and Semiconductor Package Including the Same