Patent Assignment
Reel/Frame 050053/0847
Assignment of Assignor's Interest
Recorded: 2019-08-14
Pages: 5
Assignors
YI, JAE SEOK
Executed: 2019-07-19
KIM, JUNG MIN
Executed: 2019-07-19
CHOI, CHANG HAK
Executed: 2019-07-26
KOO, BON SEOK
Executed: 2019-07-24
KANG, BYUNG WOO
Executed: 2019-07-19
KANG, HAE SOL
Executed: 2019-07-19
KYEONG, SAN
Executed: 2019-07-19
KIM, JUN HYEON
Executed: 2019-07-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Mlcc Module and Method of Manufacturing the Same