Patent Assignment
Reel/Frame 050065/0486
Assignment of Assignor's Interest
Recorded: 2019-08-15
Pages: 5
Assignors
LO, TSENG CHIN
Executed: 2017-04-11
CHANG, MOLLY
Executed: 2017-04-11
TSENG, YA-WEN
Executed: 2017-04-11
SUN, CHIH-TING
Executed: 2017-04-14
LI, ZI-KUAN
Executed: 2017-04-14
CHANG, BO-SEN
Executed: 2017-04-14
LIN, GENG-HE
Executed: 2017-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Filler and Method Thereof