Patent Assignment
Reel/Frame 050070/0620
Assignment of Assignor's Interest
Recorded: 2019-08-16
Pages: 2
Assignor
KAWADAHARA, SHO
Executed: 2019-08-07
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus, Substrate Pairing Apparatus, and Semiconductor Device Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.