Patent Assignment
Reel/Frame 050094/0257
Assignment of Assignor's Interest
Recorded: 2019-08-20
Pages: 10
Assignors
KUO, CHIH-WEI
Executed: 2019-08-15
HOU, TAI-CHENG
Executed: 2019-08-15
LAI, YU-TSUNG
Executed: 2019-08-15
LIAO, JIUNN-HSIUNG
Executed: 2019-08-15
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same