Patent Assignment
Reel/Frame 050097/0564
Assignment of Assignor's Interest
Recorded: 2019-08-20
Pages: 4
Assignors
KWOK, TSZ-MEI
Executed: 2019-08-08
YANG, TSUNG-HSI
Executed: 2019-08-08
YU, JENG-WEI
Executed: 2019-08-08
CHOU, LI-WEI
Executed: 2019-08-08
YU, MING-HUA
Executed: 2019-08-08
LI, CHII-HORNG
Executed: 2019-08-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming Same