Patent Assignment
Reel/Frame 050106/0887
Assignment of Assignor's Interest
Recorded: 2019-08-20
Pages: 10
Assignors
PROBST, DEAN E.
Executed: 2019-06-05
NEULS, JEFFERY A.
Executed: 2019-06-05
EDA, MASAICHI
Executed: 2019-06-05
MCGRATH, PETER
Executed: 2019-06-05
BURKE, PETER A.
Executed: 2019-06-17
VENKATRAMAN, PRASAD
Executed: 2019-05-29
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Forming a Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
Corrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest.
Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
Release of Security Interest in Patents Recorded at Reel 051145, Frame 0062
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0474 →