Patent Assignment
Reel/Frame 064079/0474
Release of Security Interest in Patents Recorded at Reel 051145, Frame 0062
Recorded: 2023-06-23
Pages: 432
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(159)
Ground Fault Interrupter Self Test Circuits and Related Methods
Semiconductor Package Having Magnetic Interconnects and Related Methods
Methods and Apparatus for an Interface
Semiconductor Devices and Methods of Making the Same
Application:
16/459,954 →
Publication:
US 2019/0326202
Switch Mode Power Supply with Ramp Generator for Wide Frequency Range Pulse Width Modulator or the Like
Imaging Systems with Weathering Detection Pixels
Imaging Systems with Improved Near-Infrared Detection Pixels
Image Sensors with Reduced Signal Sampling Kickback
Image Sensor with Near-Infrared and Visible Light Phase Detection Pixels
Semiconductor Device with Single-Photon Avalanche Diode Pixels and a Light Attenuating Layer
Image Sensors Having High Dynamic Range Imaging Pixels
Patent:
10,791,292 →
Application:
16/502,298 →
Backside Illuminated Image Sensors with Pixels That Have High Dynamic Range, Dynamic Charge Overflow, and Global Shutter Scanning
Application:
16/502,349 →
Publication:
US 2020/0244900
Comparator System Having Internal Input Offset Voltage
Image Sensors Having Boost Current Control Circuitry for Column Settling Speedup
Application:
16/502,381 →
Publication:
US 2020/0396402
Image Sensors with High Dynamic Range and Flicker Mitigation
Semiconductor Package with Guide Pin
Etched Nickel Plated Substrate and Related Methods
Leadframe Systems and Related Methods
Backside Metal Removal Die Singulation Systems and Related Methods
Partial Backside Metal Removal Singulation System and Related Methods
Backside Metal Patterning Die Singulation Systems and Related Methods
Backside Metal Patterning Die Singulation System and Related Methods
Backside Metal Patterning Die Singulation Systems and Related Methods
Backside Metal Photolithographic Patterning Die Singulation Systems and Related Methods
Substrate Alignment Systems and Related Methods
Backside Wafer Alignment Methods
Methods of Aligning a Semiconductor Wafer for Singulation
Metal Insulator Metal (Mim) Capacitors
Application:
16/506,040 →
Publication:
US 2020/0328271
Image Sensor Devices and Related Methods
Application:
16/506,087 →
Publication:
US 2020/0273896
Semiconductor Package with Heatsink
Controllable Gap Height for an Image Sensor Package
An Image Sensor Package Having a Light Blocking Member
Power Module Housing
Electronic Device Including a Conductive Layer Including a Ta Si Compound and a Process of Forming the Same
Application:
16/510,601 →
Publication:
US 2019/0334021
Fan-Out Wafer Level Chip-Scale Packages and Methods of Manufacture
Heat Transfer for Power Modules
Schottky Rectifier with Surge-Current Ruggedness
Transistor Device Having a Source Region Segments and Body Region Segments
Internal Power Supply for Amplifiers
Digital Buffer Circuit
Patent:
10,707,872 →
Application:
16/512,991 →
Power Semiconductor Device Package
System and Method for Controlling a Low-Dropout Regulator
Circuit and Method for Controlling a Coil Current During a Soft Shut Down
Radio Frequency Switch
Patent:
10,673,412 →
Application:
16/514,174 →
Amplifier with Local Feedback Loop
Electronic Device Including a Semiconductor Body or an Isolation Structure Within a Trench
Electronic Device Including a High Electron Mobility Transistor Including a Gate Electrode and a Dielectric Film
Insulated Gated Field Effect Transistor Structure Having Shielded Source and Method
Controller for Closed Loop Control of a Dcx Converter and Method Therefor
Patent:
10,658,937 →
Application:
16/515,389 →
System and Method for Shaping Input Current in Light Emitting Diode (Led) System
Control Circuit for Programmable Power Supply
Semiconductor Package and Related Methods
Led Drive Circuit with a Programmable Input for Led Lighting
Power Semiconductor Devices
Network Event Based Security and Home Automation
Bidirectional Leakage Compensation Circuits for Use in Integrated Circuits and Method Therefor
Termination Structure for Insulated Gate Semiconductor Device and Method
Offset Voltage Trimming for Operational Amplifiers
Ultrasonic Sensor Having Edge-Based Echo Detection
Cable Compensation Circuit and Power Supply Including the Same
Ultrasonic Sensor with Echo Magnification
Start-Up Circuit to Discharge Emi Filter for Power Saving of Power Supplies
Method of Forming a Semiconductor Device Termination and Structure Therefor
Application:
16/532,816 →
Publication:
US 2019/0363158
Methods of Forming Image Sensor Integrated Circuit Packages
Application:
16/533,509 →
Publication:
US 2019/0363121
Method of Separating Electronic Devices Having a Back Layer and Apparatus
Stacked Image Sensor Package
Application:
16/536,971 →
Publication:
US 2019/0363122
Edge Seals for Semiconductor Packages
Sic Mosfet Semiconductor Packages and Related Methods
Through-Substrate via Structure and Method of Manufacture
Semiconductor Device and Method of Forming Cantilevered Protrusion on a Semiconductor Die
Methods and Apparatus for a Battery
Method of Forming a Semiconductor Device and Structure Therefor
Semiconductor Die Singulation Methods
Method of Forming a Semiconductor Device
Trench Semiconductor Device Having Multiple Active Trench Depths and Method
Power Supply System for Optimizing a Performance Metric Using Artificial Intelligence
Power Supply System for Controlling a Zvs Parameter to Optimize Efficiency Using Artificial Intelligence
Power Supply System for Optimizing Standby Power Using Artificial Intelligence
Power Supply System for Optimizing Overall Efficiency Using Artificial Intelligence
Semiconductor Package Structures and Methods of Manufacture
Quad Leadframe Packages and Related Methods
Inductive Position Sensor
Level-Shifting Circuit Configured to Limit Leakage Current
Packaged Semiconductor Devices with Multi-Use Input Contacts and Related Methods
Application:
16/563,285 →
Publication:
US 2019/0393146
Vertically Stacked Multichip Modules
Pixel Control Signal Verification in a Stacked Image Sensor
Bond-Over-Active Circuity Gallium Nitride Devices
Low Noise Differential Amplifier
Charge Pump Circuit for Providing Voltages to Multiple Switch Circuits
Semiconductor Device Including a Fuse and a Transistor Coupled to the Fuse
Lead Angle Adjustment Circuit
Semiconductor Substrate Production Systems and Related Methods
Adaptive Gate Driver
Trench Diode and Method of Forming the Same
Multi-Input Downconversion Mixer
High Dynamic Range Pixel Using Light Separation
Application:
16/583,743 →
Publication:
US 2020/0020730
Fin Frame Assemblies
Dual-Control Led Dimming System and Method
Press-Fit Pin Case
Patent:
922,329 →
Application:
29/697,995 →
Methods and Circuitry for Improving Global Shutter Efficiency in Backside Illuminated High Dynamic Range Image Sensor Pixels
Application:
62/871,899 →
Pre-Stacking Mechanical Strength Enhancement of Power Device Structures
Application:
62/871,935 →
Image Sensors with in-Pixel Amplification Circuitry
Application:
62/872,620 →
Harq Framing, Codeword Nack, and Dual Error Detection with Retransmission
Application:
62/874,406 →
Zero-Quiescent-Current Auto-Biased Current Limit Protection
Application:
62/875,343 →
Imaging Systems and Methods for Generating High Dynamic Range Images
Application:
62/876,931 →
Image Sensor Packages with Tunable Polarization Layers
Application:
62/877,701 →
Adaptive Triband
Application:
62/877,757 →
Methods and System for Induction Heating
Application:
62/877,928 →
Imaging Systems and Methods for Reducing Dark Signal Non-Uniformity Across Pixels
Application:
62/878,089 →
Solder Bump Formation Using Wafer with Ring
Application:
62/878,213 →
Adaptive Constant Current Engine
Application:
62/878,595 →
Methods and Apparatus for a Voice Detector
Application:
62/881,497 →
Methods and Systems of a Switching Power Converter for Controlling Average Current and with Frequency Adjustment
Application:
62/881,631 →
Load Line Circuit for Voltage Regulators
Application:
62/881,642 →
Electronic Device Including a Polymer Support Layer and a Process of Forming the Same
Application:
62/881,661 →
Gain-Control Circuit and Method for Instrumentation Amplifiers
Application:
62/882,090 →
Low Stress Asymmetric Dual Side Module
Application:
62/882,119 →
Methods and Apparatus for an Interface
Application:
62/882,136 →
Semiconductor Device and Method Therefor
Application:
62/884,749 →
Imaging Systems and Methods for Performing Analog Domain Regional Pixel Level Feature Extraction
Application:
62/885,387 →
Image Sensors Having Analog Memory Cells for Improved Dynamic Range
Application:
62/885,698 →
Power Device with Carrier Lifetime Zone
Application:
62/885,879 →
Silicon Carbide Trench Power Device
Application:
62/885,882 →
Imaging Systems and Methods for Operating a Variable Conversion Gain Pixel for Analog Domain Regional Feature Extraction
Application:
62/886,613 →
Method and System of a Switching Power Converter
Application:
62/886,639 →
Imaging Systems and Methods for Performing Pixel Binning and Variable Integration for Analog Domain Regional Feature Extraction
Application:
62/887,748 →
Semiconductor Power Device and Method for Manufacture
Application:
62/887,759 →
Imaging Systems and Methods for Performing Floating Gate Readout via Distributed Pixel Interconnects for Analog Domain Regional Feature Extraction
Application:
62/889,630 →
Methods and Apparatus for Increased Sensitivity of a Capacitive Sensor
Application:
62/890,196 →
Voltage Clamping Circuit
Application:
62/890,690 →
Methods and Systems to Optimize Dbvc Performance for Throughput and Stability
Application:
62/890,970 →
Imaging System with Shot-Noise-Matched and Floating-Point Ramp Analog-to-Digital Converters
Application:
62/890,986 →
Imaging Devices with Capacitively Coupled Single-Photon Avalanche Diodes
Application:
62/891,804 →
Event Sensors with Flicker Analysis Circuitry
Application:
62/892,830 →
Methods and Systems for Per-Tone Sounding with Snr Using Capture Mode
Application:
62/892,852 →
Silcon Carbide Field-Effect Transistors
Application:
62/894,017 →
Opto-Electronic Hemt
Application:
62/895,807 →
Electronic Device Including a Protection Circuit
Application:
62/895,833 →
Stray Inductance Reduction in Packaged Semiconductor Devices
Application:
62/895,875 →
Semiconductor Device Package Assemblies and Methods of Manufacture
Application:
62/895,877 →
Methods and Systems of Controlling Switching Frequency of Llc Resonant Power Converters
Application:
62/896,247 →
Multi-Stage Analog to Digital Converter
Application:
62/896,426 →
Imaging Systems Having Successive Approximation Register (Sar) Analog-to-Digital Converters with Reduced Non-Linearity
Application:
62/897,629 →
Silicon Photomultipliers with Split Microcells
Application:
62/897,649 →
Configurable Pixel Readout Circuit for Imaging and Time of Flight Measurements
Application:
62/897,801 →
Circuit and Method for Controlling Power Converter Based on Feedback Current
Application:
62/898,109 →
Radar Array Phase Shifter Verification
Application:
62/898,141 →
Radar Front End Device with Chaining Support
Application:
62/898,233 →
Methods and System for a Battery
Application:
62/899,262 →
Methods and System for a Battery
Application:
62/899,832 →
Clock Switching Circuit and Method
Application:
62/899,940 →
Uninterrupted Current Sense
Application:
62/900,168 →
Systems and Methods for Image Sensor Security
Application:
62/902,677 →
Potentiostat Circuit
Application:
62/905,768 →
Imaging Devices with Single-Photon Avalanche Diodes Having Sub-Exposures for High Dynamic Range
Application:
62/905,787 →
Methods and Apparatus for an Auxiliary Channel
Application:
62/905,957 →
Systems and Methods for Electrical Charge Dissipation
Application:
62/906,267 →
Peak Current Limit in a Slope-Compensated Current Mode Dc-Dc Converter
Application:
62/907,252 →
Methods and Systems of Operating Power Converters
Application:
62/907,795 →
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 1, 2019
From: ARMSTRONG, BRUCE G.; SINGH, RISHI PRATAP; KONDUR SURYA KUMAR, SANATH KUMAR; BECK, RILEY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049647/0222 →
Assignment of Assignor's Interest
Jul 1, 2019
From: GAMBINO, JEFFREY PETER; LONG, THOMAS F.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049647/0264 →
Assignment of Assignor's Interest
Jul 2, 2019
From: PERKINS, ANDREW EUGENE; BORTHAKUR, SWARNAL; SULFRIDGE, MARC ALLEN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049658/0268 →
Assignment of Assignor's Interest
Jul 2, 2019
From: BENJARAM, RAJASHEKAR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049671/0854 →
Assignment of Assignor's Interest
Jul 2, 2019
From: KHAN. P, ATHAR ALI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049651/0728 →
Assignment of Assignor's Interest
Jul 2, 2019
From: ST. GERMAIN, STEPHEN; ARBUTHNOT, ROGER M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049653/0299 →
Assignment of Assignor's Interest
Jul 2, 2019
From: ZHU, HUA; YAO, KAIWEI
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 049654/0577 →
Assignment of Assignor's Interest
Jul 2, 2019
From: MICINSKI, STANLEY; BORTHAKUR, SWARNAL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049657/0875 →
Assignment of Assignor's Interest
Jul 2, 2019
From: JOHNSON, RICHARD SCOTT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049657/0604 →
Assignment of Assignor's Interest
Jul 2, 2019
From: BOETTIGER, ULRICH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049658/0470 →
Assignment of Assignor's Interest
Jul 3, 2019
From: YAO, YUSHUANG; PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; NIU, CHUNCAO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049662/0786 →
Assignment of Assignor's Interest
Jul 3, 2019
From: PALANIAPPAN, NANDA; OH, MINSEOK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049662/0711 →
Assignment of Assignor's Interest
Jul 3, 2019
From: TAKAKUSAKI, SADAMICHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049663/0007 →
Assignment of Assignor's Interest
Jul 3, 2019
From: GEURTS, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049661/0619 →
Assignment of Assignor's Interest
Jul 3, 2019
From: HYNECEK, JAROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049661/0892 →
Assignment of Assignor's Interest
Jul 3, 2019
From: ISHIDA, MANABU
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049662/0219 →
Assignment of Assignor's Interest
Jul 3, 2019
From: FRESON, TOM
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049662/0245 →
Assignment of Assignor's Interest
Jul 8, 2019
From: INOGUCHI, HIROSHI; OCHIAI, ISAO; TAGUCHI, TAKAYUKI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049690/0016 →
Security Interest
Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
Corrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest.
Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →