Image sensor package having a light blocking member
According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.
1. An image sensor package comprising:
a substrate having a surface disposed within a plane;
an image sensor die coupled to the substrate, the image sensor die including an active area;
a light transmitting member including a first surface and a second surface, the second surface of the light transmitting member being coupled to the image sensor die via one or more dam members such that an empty space exists between the active area of the image sensor die and the second surface of the light transmitting member, the light transmitting member including a first edge and a second edge, the first edge and the second edge being perpendicular to the surface of the substrate;
an encapsulation material; and
a light blocking member including a first portion, an entirety of the first portion being coupled directly to the light transmitting member, the first portion extending to the first edge, the light blocking member including a second portion coupled directly to the light transmitting member and extending to the second edge, the light blocking member including a third portion directly contacting a top surface of the encapsulation material, the first portion having a length greater than a length of a dam member in a first direction, the first direction being aligned parallel to the plane.
2. The image sensor package of claim 1 , wherein the light blocking member includes a non-transparent material configured to block light.
3. The image sensor package of claim 1 , wherein the light blocking member includes an anti-electrostatic discharge material.
4. The image sensor package of claim 1 , wherein the light blocking member includes a non-transparent layer coupled to the first surface of the light transmitting member.
5. The image sensor package of claim 1 , wherein the light blocking member includes a non-transparent layer coupled to the second surface of the light transmitting member.
6. The image sensor package of claim 1 , wherein the light blocking member includes a non-transparent dam member coupled to the second surface of the light transmitting member.
7. The image sensor package of claim 1 , further comprising:
one or more bond wires connected to the substrate and the image sensor die, wherein the encapsulation material encapsulates the one or more bond wires.
8. An image sensor package comprising:
a substrate having a surface disposed within a plane;
an image sensor die coupled to the substrate, the image sensor die including an active area;
a light transmitting member including a first surface and a second surface, the second surface of the light transmitting member being coupled to the image sensor die via a first dam member and a second dam member such that an empty space exists between the active area of the image sensor die and the second surface of the light transmitting member, the light transmitting member including a first edge and a second edge, the first edge and the second edge being aligned perpendicular to the surface of the substrate;
at least one bond wire connected to the substrate and the image sensor die;
an encapsulation material that encapsulates the at least one bond wire, the encapsulation material including a first outer edge coupled to the substrate and a second outer edge extending from the first outer edge, the second outer edge being coupled to the light transmitting member, the second outer edge being aligned non-parallel and non-perpendicular to the first outer edge; and
a light blocking member including a first portion directly coupled to the light transmitting member and extending to the first edge, the light blocking member including a second portion coupled directly to the light transmitting member and extending to the second edge, the light blocking member including a third portion directly contacting the second outer edge of the encapsulation material, the first portion having a length greater than a length of the first dam member in a first direction, the first direction being aligned parallel to the plane, the light blocking member not being coupled to the first outer edge of the encapsulation material.
9. The image sensor package of claim 8 , wherein the light blocking member includes a non-transparent layer coated or printed on a perimeter area of the first surface of the light transmitting member.
10. The image sensor package of claim 8 , wherein the light blocking member includes a polymer resin with electrically conductive material embedded into the polymer resin, the electrically conductive material including at least one of aluminum, gold, or copper.
11. The image sensor package of claim 8 , wherein the encapsulation material includes a molding compound.
12. The image sensor package of claim 8 , wherein the encapsulation material is formed from a liquid encapsulate.
13. The image sensor package of claim 8 , wherein the image sensor die includes a complementary metal-oxide-semiconductor (CMOS) image sensor (CIS).
14. The image sensor package of claim 8 , wherein the first outer edge has a length that is less than a length of the second outer edge, wherein the second outer edge includes a top surface of the encapsulation material.
15. The image sensor package of claim 8 , wherein the second outer edge is aligned at an incline with respect to the first outer edge, wherein the light blocking member extends along an entire length of the second outer edge.
16. The image sensor package of claim 1 , wherein the surface of the substrate is a first surface, the substrate including a second surface, wherein a distance between the first surface of the substrate and the second surface of the substrate define a thickness of the substrate, wherein a distance between the first edge of the light transmitting member and the second edge of the light transmitting member defines a length of the light transmitting member in the first direction.
17. The image sensor package of claim 1 , wherein the length of the first portion of the light blocking member is different than a length of the second portion of the light blocking member.
18. The image sensor package of claim 8 , wherein the second portion of the light blocking member has a length greater than a length of the second dam member in the first direction.
19. The image sensor package of claim 1 , wherein the encapsulation material includes a first outer edge coupled to the substrate and a second outer edge extending from the first outer edge, the second outer edge being coupled to the light transmitting member, the second outer edge being aligned non-parallel and non-perpendicular to the first outer edge, the light blocking member not coupled to the first outer edge of the encapsulation material.