Controllable gap height for an image sensor package
According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.
1. An image sensor package comprising:
a light transmitting member including a first surface and a second surface disposed opposite to the first surface, a distance between the first surface and the second surface defining a thickness of the light transmitting member in a first direction;
a substrate;
an interposer disposed between and coupled to the light transmitting member and the substrate, the interposer defining a first cavity area and a second cavity area, the interposer including a portion having a first inner edge and a second inner edge, the second inner edge being aligned non-parallel to the first inner edge, the portion including an outer edge that is aligned with an outer edge of the light transmitting member in the first direction;
an image sensor die disposed within the first cavity area of the interposer, the image sensor die having a sensor array configured to receive light through the light transmitting member and the second cavity area, the image sensor die including at least one conductive via;
a first bonding material that couples the image sensor die to the interposer within the first cavity area; and
a second bonding material that couples the interposer to the second surface of the light transmitting member.
2. The image sensor package of claim 1 , wherein the second cavity area defines at least a portion of an empty space between the light transmitting member and the sensor array.
3. The image sensor package of claim 1 , wherein the substrate is a redistribution layer.
4. The image sensor package of claim 1 , wherein the substrate has a length between a first edge and a second edge, the light transmitting member having a length that corresponds to the length of the substrate, the first edge of the substrate being aligned with the outer edge of the portion of the interposer in the first direction.
5. The image sensor package of claim 1 , wherein the image sensor die includes a complementary metal-oxide semiconductor (CMOS) image sensor.
6. The image sensor package of claim 1 , wherein the image sensor die is electrically connected to the substrate.
7. The image sensor package of claim 1 , wherein the image sensor die includes an interconnection layer, a sensor substrate layer, and a redistribution layer, the sensor substrate layer defining the at least one conductive via.
8. The image sensor package of claim 1 , further comprising:
a plurality of conductive components coupled to the substrate.
9. The image sensor package of claim 1 , further comprising:
a device coupled to the substrate;
a secondary substrate; and
a molding that extends between the substrate and the secondary substrate.
10. The image sensor package of claim 9 , wherein the device is coupled to the substrate in a flip-chip configuration.
11. The image sensor package of claim 1 , wherein the interposer has a thickness that is at least twice a thickness of the second bonding material.
12. An image sensor package comprising:
a light transmitting member including a first surface and a second surface disposed opposite to the first surface, a distance between the first surface and the second surface defining a thickness of the light transmitting member in a first direction, the light transmitting member including length defined between a first outer edge and a second outer edge of the light transmitting member in a second direction;
a substrate having a length defined between a first edge and a second edge of the substrate, the first outer edge extending along an axis aligned with the first edge;
an interposer disposed between and coupled to the light transmitting member and the substrate, the interposer defining a cavity area, the interposer including a first portion having a first inner edge and a second inner edge, the second inner edge being aligned non-parallel to the first inner edge, the first portion including an outer edge that is aligned with the first outer edge of the light transmitting member in the first direction;
an image sensor die disposed within the cavity area of the interposer, wherein a distance between a sensor array of the image sensor die and the light transmitting transparent member defines a gap height, the gap height being based on a size of the interposer;
a first bonding material that couples the image sensor die to the interposer within the cavity area; and
a second bonding material that couples the interposer to the second surface of the light transmitting member.
13. The image sensor package of claim 12 , wherein the image sensor die includes an interconnection layer, a sensor substrate layer, and a redistribution layer, the sensor substrate layer defining one or more conductive vias.
14. The image sensor package of claim 12 , further comprising
a conductive trace coupled to the interposer within the cavity area, the conductive trace extending to the substrate; and
a conductive component coupled to the conductive trace and the image sensor die.
15. The image sensor package of claim 12 , wherein the substrate includes a first surface and a second surface, the first surface of the substrate being coupled to the image sensor die, the image sensor package further comprising:
a device coupled to the second surface of the substrate.
16. The image sensor package of claim 15 , wherein the substrate is a first substrate, the image sensor package further comprising:
a second substrate; and
a molding disposed between the first substrate and the second substrate, the molding encapsulating the device.
17. The image sensor package of claim 16 , further comprising:
one or more conductive vias extending through the molding.
18. The image sensor package of claim 12 , wherein the interposer includes a second portion, the second portion being separate from the first portion by the cavity.
19. An image sensor package comprising:
a light transmitting member including a first surface and a second surface disposed opposite to the first surface, a distance between the first surface and the second surface defining a thickness of the light transmitting member in a first direction;
a substrate having a length between a first edge and a second edge, the light transmitting member having a length that corresponds to the length of the substrate in a second direction;
an interposer disposed between and coupled to the light transmitting member and the substrate, the interposer defining a first cavity area and a second cavity area, the interposer including a first portion and a second portion, the first portion including a first inner edge and a second inner edge, the second inner edge being disposed at a non-zero angle with respect to the first inner edge, the first portion including an outer edge that is aligned with the first outer edge of the light transmitting member in the first direction;
an image sensor die disposed within the first cavity area of the interposer, the image sensor die having a sensor array configured to receive light through the light transmitting member and the second cavity area;
a first bonding material that couples the image sensor die to the interposer within the first cavity area; and
a second bonding material that couples the interposer to the second surface of the light transmitting member.
20. The image sensor package of claim 19 , wherein the image sensor die includes an interconnection layer, a sensor substrate layer, and a redistribution layer, the sensor substrate layer defining at least one conductive via.
21. The image sensor package of claim 19 , wherein the first portion of the interposer has an L-shape and the second portion of the interposer has an L-shape.