IP Library Assignment 049703/0829
Patent Assignment
Reel/Frame 049703/0829

Assignment of Assignor's Interest

Recorded: 2019-07-09 Pages: 3
Assignor
WU, WENG-JIN
Executed: 2019-04-03
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Controllable Gap Height for an Image Sensor Package
Application: 16/506,442 →
Publication: US 2020/0321375
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
Corrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest. Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
Release of Security Interest in Patents Recorded at Reel 051145, Frame 0062 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0474 →