Fin frame assemblies

1. A fin frame assembly, comprising:

a baseplate configured to be coupled to a substrate; and

a fin frame comprising a base portion coupled to the baseplate and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion;

wherein the fin frame comprises a plurality of openings therethrough; and one of:

where a shape of each opening of the plurality of openings corresponds with a shape of each fin of the plurality of fins; or

where a shape of each opening of the plurality of openings corresponds with a shape of two or more fins of the plurality of fins.

2. The fin frame assembly of claim 1 , wherein a shape of each fin of the plurality of fins is substantially rectangular.

3. The fin frame assembly of claim 1 , wherein the plurality of fins comprise pairs of fins, each of the pairs of fins comprising complementarily angled portions defined by a diagonal line between each fin in each pair of fins.

4. The fin frame assembly of claim 1 , further comprising a cooling jacket coupled to the baseplate over the fin frame.

5. The fin frame assembly of claim 4 , wherein the cooling jacket is configured to direct a cooling fluid to pass over the plurality of fins.

6. The fin frame assembly of claim 1 , wherein the fin frame is comprised of a single piece of material.

7. The fin frame assembly of claim 1 , wherein the fin frame is coupled to the baseplate by at least one of welding, soldering, or bonding.

8. A conductive plate, comprising:

a baseplate configured to be coupled to a substrate;

a plurality of folded projections coupled at a plurality of openings; and

a cooling jacket coupled to the baseplate over the plurality of folded projections;

wherein a shape of each folded projection of the plurality of folded projections corresponds with a shape of each opening of the plurality of openings.

9. The conductive plate of claim 8 , wherein the shape of each opening of the plurality of openings corresponds with a shape of two or more folded projections of the plurality of folded projections.

10. The conductive plate of claim 8 , wherein the shape of each folded projection of the plurality of folded projections is substantially rectangular.

11. The conductive plate of claim 8 , wherein the plurality of folded projections comprise pairs of folded projections, each of the pairs of folded projections comprising complementarily angled portions defined by a diagonal line between each folded projection in each pair of folded projections.

12. The conductive plate of claim 8 , wherein the cooling jacket is configured to direct a cooling fluid to pass over the plurality of folded projections.

13. The conductive plate of claim 8 , wherein the plurality of folded projections is comprised of a single piece of material.

14. The conductive plate of claim 8 , wherein the plurality of folded projections is coupled to the baseplate by at least one of welding, soldering, or bonding.

15. A fin frame assembly, comprising: a baseplate configured to be coupled to a substrate; a first set of regularly spaced projections formed from a first strip of material, the first set of regularly spaced projections comprising base portions coupled to the baseplate; and a second set of regularly spaced projections formed from a second strip of material physically separate from the first strip of material the second set of regularly spaced projections comprising base portions coupled to the baseplate; wherein the first set of regularly spaced projections is staggered relative to the second set of regularly spaced projections; and wherein the base portions of the first set of regularly spaced projections and the second set of regularly spaced projections couple within a perimeter of a plurality of recesses formed in the baseplate.

16. The fin frame assembly of claim 15 , wherein a first group of the first set of regularly spaced projections is regularly higher than a second group of the first set of regularly spaced projections.