Semiconductor substrate production systems and related methods
Implementations of a method of separating a wafer from a boule including semiconductor material may include: creating a damage layer in a boule comprising semiconductor material. The boule may have a first end and a second end. The method may include cooling the first end of the boule and heating the second end of the boule. A thermal gradient may be formed between the cooled first end and the heated second end. The thermal gradient may assist a silicon carbide wafer to separate from the boule at the damage layer.
1. A method of separating a wafer from a boule comprising a semiconductor material, the method comprising:
creating a damage layer in a boule comprising semiconductor material, wherein the boule has a first end and a second end; and
cooling the first end of the boule;
wherein a thermal gradient between the first end and the second end assists a silicon carbide wafer to separate from the boule at the damage layer.
2. The method of claim 1 , wherein the damage layer is created through laser irradiation.
3. The method of claim 1 , further comprising heating the second end of the boule.
4. The method of claim 3 , wherein heating the second end of the boule comprises applying pulses of heat using a heating chuck.
5. The method of claim 1 , wherein cooling the first end of the boule further comprises contacting the first end of the boule with liquid nitrogen.
6. The method of claim 1 , wherein cooling the first end of the boule further comprises contacting the first end of the boule with liquid nitrogen.
7. The method of claim 3 , further comprising placing the second side of the boule on a heating chuck and one of peeling, prying, and twisting the first end of the boule with a grip while applying heat to the second side of the boule.
8. A method of separating a wafer from a boule of silicon carbide, the method comprising:
creating a damage layer in a boule of silicon carbide, wherein the boule has a first end and a second end;
applying a material onto the second end of the boule; and
heating the material at the second end of the boule;
wherein a thermal gradient caused by heating the second end of the boule assists a silicon carbide wafer to separate from the boule at the damage layer.
9. The method of claim 8 , wherein the damage layer is created through laser irradiation.
10. The method of claim 8 , wherein the material increases thermal conduction to the second end of the boule.
11. The method of claim 8 , further comprising cooling the first end of the boule.
12. The method of claim 8 , wherein heating the second end of the boule comprises applying pulses of heat through a heating chuck.
13. The method of claim 8 , wherein heating the second end of the boule further comprises applying a hot liquid to the second end of the boule.
14. The method of claim 8 , wherein heating the second end of the boule further comprises rapidly immersing the second end of the boule into a hot liquid.
15. The method of claim 8 , further comprising placing the second side of the boule on a heating chuck, one of peeling, prying, and twisting the first end of the boule with a grip while applying heat to the second side of the boule.
16. A method of separating a wafer from a boule of silicon carbide, the method comprising:
cooling or heating an end of a boule;
creating a damage layer in a boule of silicon carbide, wherein the boule has a first end and a second end;
creating a thermal gradient between the first end and the second end of the boule; and
mechanically separating a silicon carbide wafer from the boule at the damage layer.
17. The method of claim 16 , wherein the end of the boule is contacted to a heating chuck and heated rapidly.
18. The method of claim 16 , wherein heating the end of the boule further comprises applying pulses of heat through a heating chuck.
19. The method of claim 16 , wherein heating the end of the boule further comprises applying a hot liquid to the end of the boule.
20. The method of claim 16 , wherein heating the end of the boule further comprises immersing the end of the boule into a hot liquid.