Pixel control signal verification in a stacked image sensor
View Patent ↗An image sensor may be formed from stacked first and second substrates. An array of imaging pixels and verification circuitry may be formed in the first substrate. Row control circuitry may be formed in the second substrate. The row control circuitry may provide row control signals to the array of imaging pixels. The verification circuitry may also receive the row control signals from the row control circuitry. The first substrate may include a plurality of n-channel metal-oxide semiconductor transistors and may not include any p-channel metal-oxide semiconductor transistors. The verification circuitry may include an SR latch circuit with an S node coupled to a pull-up line and an R node coupled to a pull-down transistor to ensure the SR latch circuit starts up in a set state. The verification circuitry may include a level shifter that shifts a control signal voltage when the control signal is at a low level.
1. An image sensor comprising:
an array of imaging pixels; and
verification circuitry configured to test operation of the array of imaging pixels, wherein the verification circuitry has an SR latch circuit associated with a given row of imaging pixels and wherein the SR latch circuit includes a first node that is coupled to a pull-up bias line that is configured to ensure the SR latch circuit starts in a set state.
2. The image sensor defined in claim 1 , wherein the first node is an S node for the SR latch circuit and wherein the SR latch circuit includes an R node.
3. The image sensor defined in claim 2 , wherein the SR latch circuit further comprises:
a first transistor coupled to the R node, wherein the first transistor has a gate that receives a transfer control signal associated with the given row of imaging pixels; and
a second transistor coupled to the S node, wherein the second transistor has a gate that receives a reset control signal associated with the given row of imaging pixels.
4. The image sensor defined in claim 3 , wherein the SR latch circuit is configured to verify that the reset control signal and the transfer control signal are asserted in a correct order.
5. The image sensor defined in claim 3 , wherein the SR latch circuit is formed in a first substrate, wherein the first substrate includes a plurality of n-channel metal-oxide semiconductor (nMOS) transistors and does not include any p-channel metal-oxide semiconductor (pMOS) transistors, and wherein the pull-up bias line is coupled to a pMOS current source that is formed in a second substrate.
6. The image sensor defined in claim 2 , wherein the SR latch circuit further comprises:
a pull-down transistor that is coupled to the R node and that is configured to ensure the SR latch circuit starts in the set state.
7. The image sensor defined in claim 6 , further comprising:
an inverter that receives a row select control signal associated with the given row of imaging pixels and that outputs an inverted version of the row select control signal, wherein the pull-down transistor has a gate that receives the inverted version of the row select control signal.
8. An image sensor comprising:
an array of imaging pixels; and
verification circuitry configured to test operation of a given row of imaging pixels, wherein the verification circuitry comprises:
an inverter that receives a row select control signal associated with the given row of imaging pixels and that outputs an inverted version of the row select control signal; and
an SR latch circuit associated with the given row of imaging pixels, wherein the SR latch circuit includes a first node that is coupled to a pull-down transistor and wherein the pull-down transistor has a gate that receives the inverted version of the row select control signal.
9. The image sensor defined in claim 8 , wherein the first node is an R node for the SR latch circuit and wherein the SR latch circuit also includes an S node.
10. The image sensor defined in claim 9 , wherein the SR latch circuit further comprises:
a first transistor coupled to the R node, wherein the first transistor has a gate that receives a transfer control signal associated with the given row of imaging pixels; and
a second transistor coupled to the S node, wherein the second transistor has a gate that receives a reset control signal associated with the given row of imaging pixels.
11. The image sensor defined in claim 10 , wherein the SR latch circuit is configured to verify that the reset control signal and the transfer control signal are asserted in a correct order.
12. The image sensor defined in claim 9 , wherein the S node is coupled to a pull-up bias line, wherein the pull-down transistor is configured to keep the R node low when the SR latch circuit is not being used, and wherein the pull-up bias line is configured to keep the S node high when the SR latch circuit is not being used.
13. The image sensor defined in claim 8 , wherein the SR latch circuit is formed in a first substrate and wherein the first substrate includes a plurality of n-channel metal-oxide semiconductor (nMOS) transistors and does not include any p-channel metal-oxide semiconductor (pMOS) transistors.
14. An image sensor comprising:
an array of imaging pixels; and
verification circuitry blocks configured to test operation of the array of imaging pixels, wherein each verification circuitry block is associated with a respective row of imaging pixels and wherein each verification circuitry block comprises:
an SR latch circuit, wherein the SR latch circuit includes a first node that is coupled to a pull-up bias line that is configured to ensure the SR latch circuit starts in a set state.