IP Library Granted Patent US 10,673,412
Granted Patent B1
US 10,673,412 · App. 16/514,174 · Granted Jun 2, 2020

Radio frequency switch

Inventor: Gareth Pryce Weale (New Hamburg, CA)
Assignee: Semiconductor Components Industries, LLC
H03H11/245H03G1/007H03K17/687H03K17/6871H03K17/6874H03K17/693H03H11/28H03K2017/6878H04B1/44
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Quick Facts
Patent No.
US 10,673,412
App. No.
16/514,174
Granted
Jun 2, 2020
Kind
B1
Abstract

A radio frequency switch is disclosed. The RF switch uses a combination of transistor technology and a topology to create an RF switch that has a high isolation and a high voltage breakdown at frequencies including those above a gigahertz.

Claims (39)

1. A radio frequency (RF) switch comprising:

a first III-V transistor coupled between an input of the RF switch and a shunt-connection node, the first III-V transistor controllable by a first control signal applied to a gate of the first III-V transistor;

a second III-V transistor coupled between the shunt-connection node and an output of the RF switch, the second III-V transistor controllable by the first control signal applied to a gate of the second III-V transistor; and

at least one silicon on insulator (SOI) transistor coupled between the shunt-connection node and a ground, the at least one SOI transistor controllable by a second control signal applied to a gate of the at least one SOI transistor.

2. The RF switch according to claim 1 , wherein the first III-V transistor and the second III-V transistor are gallium arsenide (GaAs).

3. The RF switch according to claim 1 , wherein the first III-V transistor and the second III-V transistor are silicon carbide (SiC).

4. The RF switch according to claim 1 , wherein the first III-V transistor and the second III-V transistor are gallium nitride (GaN).

5. The RF switch according to claim 1 , wherein the first control signal and the second control signal are complementary ON/OFF signals that control the RF switch in an ON state or an OFF state.

6. The RF switch according to claim 5 , wherein in the ON state

the first III-V transistor and the second III-V transistor are ON to create a low impedance path between the input and the output of the RF switch; and

the at least one SOI transistor is OFF to isolate ground from the low impedance path.

7. The RF switch according to claim 5 , wherein in the OFF state

the first III-V transistor and the second III-V transistor are OFF to create a high impedance path between the input and the output; and

the at least one SOI transistor is ON to short the high impedance path to ground.

8. The RF switch according to claim 1 , wherein a breakdown voltage of the first III-V transistor and the second III-V transistor is higher than a breakdown voltage of the at least one SOI transistor.

9. The RF switch according to claim 8 , wherein the at least one SOI transistor is coupled to a voltage that is lower than a voltage coupled to first III-V transistor or the second III-V transistor.

10. The RF switch according to claim 1 , wherein the at least one SOI transistor is a stack of SOI transistors connected in series.

11. The RF switch according to claim 10 , wherein a number of SOI transistors in the stack corresponds to a break down voltage of the first III-V transistor or the second III-V transistor.

12. The RF switch according to claim 1 , wherein a frequency of an input signal to the RF switch is in a range between and including 0.5 gigahertz and 10 GHz.

13. An RF tuning system comprising:

an RF switch configured to switch an input to one of a plurality of outputs, and for each output the RF switch includes:

a pair of III-V switches connected in series between the input and the output, the pair of III-V switches connected to each other at a shunt-connection node; and

an SOI switch connected between the shunt-connection node and a ground.

14. The RF tuning system according to claim 13 , wherein the pair of III-V switches include;

a first GaN transistor coupled between the input and the shunt-connection node; and

a second GaN transistor coupled between the shunt-connection node and the output.

15. The RF tuning system according to claim 13 , wherein the SOI switch is a stack of SOI transistors.

16. The RF tuning system according to claim 15 , wherein a count of SOI transistors in the stack of SOI transistors corresponds to a breakdown voltage of one of the pair of III-V switches.

17. The RF tuning system according to claim 13 , wherein the RF switch is configured to switch the input to a particular output when the pair of III-V switches corresponding to the particular output are in an ON condition and the SOI switch corresponding to the particular output is in an OFF condition.

18. The RF tuning system according to claim 13 , wherein the RF switch is configured to isolate the input from a particular output when the pair of III-V switches corresponding to the particular output are in an OFF condition and the SOI switch corresponding to the particular output is in an ON condition.

19. A method for switching an RF signal, the method comprising:

applying an RF signal to an input node of an RF switch that includes two III-V switches connected in series between the input node and an output node, the two III-V switches connected to each other at a shunt-connection node; and

blocking the RF signal by:

controlling the two III-V switches to be in an OFF condition to block all but a leakage portion of the RF signal from the shunt-connection node, and

controlling an SOI switch that is coupled between the shunt-connection node and a ground to be in an ON condition to short the leakage portion of the RF signal to the ground.

20. The method for switching an RF signal according to claim 19 , further comprising:

passing the RF signal by:

controlling the two III-V switches to be in the ON condition to pass the RF signal from the input node to the output node, and

controlling the SOI switch to be in the OFF condition to decouple ground from the shunt-connection node.

Assignments (5)
SECURITY INTEREST Recorded Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 051145, FRAME 0062 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0474 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXCLUSION OF FAIRCHILD SEMICONDUCTOR CORPORATION OF CONVEYING PARTY PREVIOUSLY RECORDED ON REEL 051145 FRAME 0062. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Dec 3, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051170/0781 →
SECURITY INTEREST Recorded Nov 26, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 051145/0062 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2019
From: WEALE, GARETH PRYCE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049778/0062 →
Cited By (1)
US 12,640,769