Patent Assignment
Reel/Frame 050109/0599
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 6
Assignors
CHEN, SHIH-WEI
Executed: 2019-07-22
TSAI, HAO-YI
Executed: 2019-07-22
PAN, KUO-LUNG
Executed: 2019-07-17
KUO, TIN-HAO
Executed: 2019-07-17
TENG, PO-YUAN
Executed: 2019-07-22
LAI, CHI-HUI
Executed: 2019-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same