Patent Assignment
Reel/Frame 050109/0612
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 5
Assignors
HUNG, TUAN-YU
Executed: 2019-07-19
YANG, CHING-FENG
Executed: 2019-07-22
KUO, HUNG-JUI
Executed: 2019-07-19
WU, KAI-CHIANG
Executed: 2019-07-22
HO, MING-CHE
Executed: 2019-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof