Patent Assignment
Reel/Frame 050109/0620
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 5
Assignors
CHEN, WEI-CHIH
Executed: 2019-07-17
KUO, HUNG-JUI
Executed: 2019-07-17
HU, YU-HSIANG
Executed: 2019-07-17
LIAO, SIH-HAO
Executed: 2019-07-17
CHO, HUNG-CHUN
Executed: 2019-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same
Patent:
10,833,053 →
Application:
16/513,732 →