Patent Assignment
Reel/Frame 050112/0494
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 4
Assignor
KAWAGOE, HIROSHI
Executed: 2018-03-29
Assignee
KYOCERA CORPORATION
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Wiring Substrate, Electronic Device, and Electronic Module