Wiring substrate, electronic device, and electronic module
A wiring substrate includes an insulating substrate being square in plan view, the insulating substrate including one main surface with a recess, and the other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate. The external electrodes are arranged in a row in a peripheral section of the insulating substrate. In plan view, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.
1. A wiring substrate comprising:
an insulating substrate comprising one main surface with a recess, and an other main surface opposite to the one main surface, the insulating substrate being square in plan view of the one main surface; and
a plurality of external electrodes located in a row in a peripheral section of the other main surface of the insulating substrate, wherein in plan view of the other main surface, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side,
in plan view of the other main surface, the one of the external electrodes located at the edge of the each side of the insulating substrate is larger in length along a direction perpendicular to the each side than the one of the external electrodes located at the center of the each side, and
the one of the external electrodes located at the edge of the each side includes a first side along the perpendicular direction in plan view of the other main surface, the one of the external electrodes located at the center of the each side includes a second side parallel to the first side in plan view of the other main surface, and a length of the first side extends beyond a length of the second side.
2. The wiring substrate according to claim 1 , wherein the external electrodes are arranged into a band-shape.
3. The wiring substrate according to claim 1 , wherein in plan view of the other main surface, areas of the external electrodes become gradually larger from the edge toward the center of the each side of the insulating substrate.
4. The wiring substrate according to claim 1 , wherein the recess is square in plan view of the one main surface.
5. The wiring substrate according to claim 1 , wherein the recess is circular in plan view of the one main surface.
6. An electronic device comprising:
the wiring substrate according to claim 1 ; and
an electronic component mounted on the wiring substrate.
7. An electronic module comprising:
a module substrate comprising a connection pad; and
the electronic device according to claim 6 connected to the connection pad via a solder.
8. The wiring substrate according to claim 2 , wherein in plan view of the other main surface, areas of the external electrodes become gradually larger from the edge toward the center of the each side of the insulating substrate.
9. The wiring substrate according to claim 2 , wherein the recess is square in plan view of the one main surface.
10. The wiring substrate according to claim 3 , wherein the recess is square in plan view of the one main surface.
11. The wiring substrate according to claim 8 , wherein the recess is square in plan view of the one main surface.
12. The wiring substrate according to claim 2 , wherein the recess is circular in plan view of the one main surface.
13. The wiring substrate according to claim 3 , wherein the recess is circular in plan view of the one main surface.
14. The wiring substrate according to claim 8 , wherein the recess is circular in plan view of the one main surface.