Patent Assignment
Reel/Frame 050116/0536
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 2
Assignors
WU, JIUN YI
Executed: 2019-07-23
YU, CHEN-HUA
Executed: 2019-07-23
LIU, CHUNG-SHI
Executed: 2019-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Warpage Control of Packages Using Embedded Core Frame