Patent Assignment
Reel/Frame 050120/0549
Assignment of Assignor's Interest
Recorded: 2019-08-21
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Interconnect Structures in Semiconductor Fabrication
Patent:
10,847,417 →
Application:
16/547,083 →