Patent Assignment
Reel/Frame 050143/0522
Assignment of Assignor's Interest
Recorded: 2019-08-23
Pages: 14
Assignors
GOMES, WILFRED
Executed: 2019-02-15
BOHR, MARK
Executed: 2019-02-14
KODURI, RAJABALI
Executed: 2019-02-14
NEIBERG, LEONARD
Executed: 2019-04-08
KOKER, ALTUG
Executed: 2019-02-14
SIVAKUMAR, SWAMINATHAN
Executed: 2019-05-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die Interconnection Scheme for Providing a High Yielding Process for High Performance Microprocessors