Patent Assignment
Reel/Frame 050162/0967
Assignment of Assignor's Interest
Recorded: 2019-08-26
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2019-07-29
HUANG, TZU YUN
Executed: 2019-07-26
HO, MING-CHE
Executed: 2019-07-29
KUO, HUNG-JUI
Executed: 2019-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method