Patent Assignment
Reel/Frame 050163/0886
Assignment of Assignor's Interest
Recorded: 2019-08-26
Pages: 4
Assignors
ISLAM, MUHAMMAD S.
Executed: 2019-08-02
HARRIS, ENISA
Executed: 2019-08-02
PRSTIC, SUZANA
Executed: 2019-08-02
CHAN ARGUEDAS, SERGIO
Executed: 2019-08-19
DESHMUKH, SACHIN
Executed: 2019-08-02
ANTONISWAMY, ARAVINDHA
Executed: 2019-08-02
BOZORG-GRAYELI, ELAH
Executed: 2019-08-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Chip Package with Partial Integrated Heat Spreader