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Patent Assignment
Reel/Frame 050186/0844

Assignment of Assignor's Interest

Recorded: 2019-08-27 Pages: 4
Assignors
HUANG, WEN HUNG
Executed: 2019-08-23
HUANG, MIN LUNG
Executed: 2019-08-23
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property (1)
Wiring Structure and Method of Manufacturing the Same
Application: 16/552,792 →
Publication: US 2021/0068267