Patent Assignment
Reel/Frame 050187/0198
Assignment of Assignor's Interest
Recorded: 2019-08-27
Pages: 6
Assignors
KIM, EUIYEOL
Executed: 2019-07-25
KIM, SUN-HYUN
Executed: 2019-07-25
PARK, HEEWOO
Executed: 2019-07-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including a Through Contact Extending Between Sub-Chips and Method of Fabricating the Same