Patent Assignment
Reel/Frame 050194/0832
Assignment of Assignor's Interest
Recorded: 2019-08-28
Pages: 28
Assignors
TIAN, TING
Executed: 2019-06-04
DOU, SHUGIAN
Executed: 2019-06-04
FU, XIAOLIANG
Executed: 2019-06-04
DENG, LIGUANG
Executed: 2019-06-04
ZHOU, DAYONG
Executed: 2019-06-04
FAN, ZHIQIANG
Executed: 2019-06-04
HAN, YONGJIE
Executed: 2019-06-04
ZHANG, YAWEN
Executed: 2019-06-04
WANG, ZHONGJUN
Executed: 2019-06-04
ZHANG, DONG
Executed: 2019-06-04
LIU, YU
Executed: 2019-06-04
LI, ZHERAN
Executed: 2019-06-04
KIM, HYUNGKYU
Executed: 2019-06-04
Assignees
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 8 XIHUANZHONGLU, BDA, BEIJING, 100176, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Method for Manufacturing Micro Light-Emitting Diode Array Substrate