Patent Assignment
Reel/Frame 050209/0684
Assignment of Assignor's Interest
Recorded: 2019-08-29
Pages: 6
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Board, Laminated Wiring Board, and Semiconductor Device